Blar i SINTEF Open på forfatter "Poppe, Erik Utne"

Viser treff 1-5 av 5

    • Al-Al Wafer-Level Thermocompression Bonding applied for MEMS 

      Taklo, Maaike M. Visser; Schjølberg-Henriksen, Kari; Malik, Nishant; Poppe, Erik Utne; Moe, Sigurd T.; Finstad, Terje (Chapter, 2017)
      Wafer-level thermocompression bonding (TCB) using aluminum (Al) is presented as a hermetic sealing method for MEMS. The process is a CMOS compatible alternative to TCB using metals like gold (Au) and copper (Cu), which are ...

    • Metal Films for MEMS Pressure Sensors: Comparison of Al, Ti, Al-Ti Alloy and Al/Ti Film Stacks 

      Vereshchagina, Elizaveta; Poppe, Erik Utne; Schjølberg-Henriksen, Kari; Wöhrmann, Markus; Moe, Sigurd T. (Chapter, 2018)
      Thermo-mechanical stability of metal structures is one of the key factors affecting accuracy of micro-electromechanical (MEMS) piezoresistive pressure sensors. In this work, we present the measurement results of stress and ...

    • Plastic Deformation of Thin Si Membranes in Si-Si Direct Bonding 

      Poppe, Erik Utne; Jensen, Geir Uri; Moe, Sigurd T.; Wang, Dag Thorstein (Journal article; Peer reviewed, 2016)
      The effect of bond anneal in Si-Si direct bonding of laminates With thin membranes suspending closed cavities is studied. For membranes of a certain size and thickness, it is found that the under-pressure in the cavity ...

    • Texture of Al films for wafer-level thermocompression bonding 

      Malik, Nishant; Venkatachalapathy, Vishnukanthan; Dall, Wilhelm; Schjølberg-Henriksen, Kari; Poppe, Erik Utne; Taklo, Maaike M. Visser; Finstad, Terje (Journal article; Peer reviewed, 2017)
      Properties of aluminum thin films for thermocompression bonding have been studied in terms of surface roughness, grain size, and grain orientation by AFM, SEM, XRD and EBSD for thermocompression bonding. Al films were ...

    • Wafer bonding process for zero level vacuum packaging of MEMS 

      Sordo, Guido; Collini, Cristian; Moe, Sigurd T.; Poppe, Erik Utne; Wright, Daniel Nilsen (Chapter; Peer reviewed, 2020)
      It is well known that the packaging of electronic devices is of paramount importance, none more so than in MEMS were fragile mechanical elements are realized. Among the different approaches, wafer to wafer bonding guarantees ...